As one of the world’s foremost pure-play MEMS foundries, Teledyne DALSA Semiconductor offers high-volume manufacturing on both 150 and 200 mm wafers, and delivers a complete solution, from prototype to mass production.
A comprehensive MEMS toolbox allows high volume manufacturing for a wide range of applications including pressure sensors, microphones (including inertial sensors, micro-mirrors, micro-fluidics, oscillators, RF MEMS, and microbolometers) and traditional image sensors.
Teledyne DALSA will co-exhibit with its partners from C2MI (MiQro Innovation Collaborative Centre) who support advanced MEMS development, prototyping and low-volume manufacturing.
In addition, associates from the company’s digital imaging group will be on hand to highlight their recently released and best-in-class line scan image sensors.
Quality and Trade Compliance
Teledyne DALSA is automotive certified, manufacturing according to ISO/TS 16949 (includes ISO 9001), and has ISO 14001 registration.
About Teledyne DALSA Semiconductor Located in Bromont, Quebec, Canada, Teledyne DALSA's pure-play semiconductor wafer foundry has a history of flexibility and innovation for MEMS, MOEMS and silicon-based micro-machining. As a manufacturing partner to fabless and fab-lite semiconductor companies, the foundry helps customers succeed with their advanced MEMS designs.
About Teledyne DALSA
Teledyne DALSAis an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-ray; our MEMS foundry has earned a world-leading reputation. In addition, through our subsidiaries Teledyne Optech and Teledyne Caris, we deliver advanced 3D survey and geospatial information systems. Teledyne DALSA employs approximately 1400 employees worldwide and is headquartered in Waterloo, Canada.
All trademarks are registered by their respective companies.
Teledyne DALSA reserves the right to make changes at any time without notice.